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November 27, 2023

Gabatarwa don yin murfi da jan karfe na ƙarfe (DPC)


Ana nuna tsari na tsarin yanki na DPC yumbu a cikin adadi. Da farko dai, ana amfani da laser don shirya ta hanyar ramuka a kan blank yashin subrim (120 μm ~M ~ 120 μm), sannan kuma an tsabtace subs da raƙuman ruwa na ultrasonic; Ana amfani da fasahar Magnetron don adana ƙarfe a saman sinadarin yumbu. Daga nan karami na iri (ti / cu), sannan kuma kammala samar da kariya ta hanyar hoto da ci gaba; Yi amfani da election don cika ramuka da kuma inganta sashen baƙin ƙarfe, da haɓaka ɗakunan bushewar ƙwayar iri, kuma a ƙarshe cire sehosewar bushewar ƙwayar ƙasa don kammala shirye-shiryen substrate shiri.

Dpc Process Flow


Karshen ƙarshen yanki na DPC Cermate Shiri yana ɗaukar fasahar Micromacharing Micromacharing (PCB), kayan ado, rami mai cike, farfajiya, farfajiya, farfajiya, farfajiya, farfajiya, farfajiya, farfajiya, farfajiya, farfajiya, farfajiya, farfajiya, farfajiya Gudanarwa, da sauransu), fa'idodin fasaha a bayyane yake.

Takamaiman fasali sun haɗa da:

(1) Amfani da Fasahar Micromacikin Micromacikin, layin ƙarfe akan sinadarin yumbu yana da fin finer (layin layi / layin layi na iya zama ƙasa da kauri daga Layer Circuit), don haka DPC Substrate ya dace sosai don kau da daidaitattun kayan aikin ɗakunan ƙwaƙwalwa tare da buƙatun girma;

(2) Amfani da hakar Laser da Lilla na cika fasaha don cimma matsakaiciyar tsakani tsakanin manyan na'urorin ta lantarki da hadewar na'urar na'urorin lantarki, kamar yadda aka nuna a hoto na 2 (b);

(3) The kauri daga Layer Layer ana sarrafa ta hanyar lantarki (gabaɗaya 10 μm ~ 100 μm), da kuma saman na'urori na yanzu na'urori na yanzu;

(4) Karancin shiri na yawan zafin jiki (ƙasa da 300 ° C) yana nisantar da illa ga babban zafin jiki da yadudduka na ƙarfe, kuma yana rage farashin samarwa. A taƙaice, Substrate na DPC yana da halayen daidaito mai kyau da haɗin kai, kuma mai sinadarin yanki ne na al'ada.

Dpc Ceramic Substrate Products And Cross Section

Koyaya, DPC substrates suna da wasu kasawa:

(1) Layer da'irar ƙarfe ana shirya ta ta hanyar tsari na lantarki, wanda ke haifar da babban gurbata muhalli;

(2) Matsakaicin Girma na elections ya ragu, kuma kauri daga zagaye na kewaye da 10 μm ~ 100, wanda ke da wuya ya cika bukatun manyan bukatun Na'urar Wuta na yanzu .

A halin yanzu, substic substrates ana amfani da shi galibi a cikin copper cocaging mai ɗaukar hoto.

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